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LPAM-30-01.0-L-08-2-K-TR

Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal
Samtec img
Manufacturer
Samtec
Mfr.Part
LPAM-30-01.0-L-08-2-K-TR
Package/Case
-
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Manufacturer :
Samtec
Product Category :
Board to Board & Mezzanine Connectors
Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
2.2 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
28 Gbps
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
240 Position
Number of Rows :
8 Row
Packaging :
Cut Tape, Reel
Pitch :
1.27 mm
Product :
Headers
Series :
LPAM
Stack Height :
4 mm, 4.5 mm
Termination Style :
Crimp
Voltage Rating :
250 VAC