471-2065-600
Board to Board & Mezzanine Connectors 200P NeXLev Plug Solder Balls
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- Manufacturer :
- Amphenol TCS
- Product Category :
- Board to Board & Mezzanine Connectors
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 1 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 12.5 Gb/s
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 200 Position
- Packaging :
- Tray
- Pitch :
- 1.15 mm
- Product :
- Plugs
- Series :
- NeXLev
- Stack Height :
- 14 mm, 17 mm, 22 mm, 27 mm, 30 mm
- Termination Style :
- BGA
- Voltage Rating :
- 600 V
- Datasheets
- 471-2065-600
