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- Manufacturer :
- Preci-Dip
- Product Category :
- Headers & Wire Housings
- Packaging :
- Bulk
- Datasheets
- 360-10-106-00-001101
Add to BOM
Part | Manufacturer | Stock | Description |
---|---|---|---|
360-076 | Digilent | 3 | Programmable Logic IC Development Tools Trenz TE0802: Zynq UltraScale+ MPSoC Development Board |
360-076 | Digilent | 3 | Programmable Logic IC Development Tools Trenz TE0802: Zynq UltraScale+ MPSoC Development Board |
360-10-102-00-001000 | Mill-Max | 0 | Board to Board & Mezzanine Connectors Interconnect Header |
360-10-102-00-001101 | Preci-Dip | 0 | Headers & Wire Housings |
360-10-103-00-001000 | Mill-Max | 0 | Board to Board & Mezzanine Connectors Interconnect Header |
360-10-103-00-001101 | Preci-Dip | 650 | Headers & Wire Housings |
360-10-104-00-001000 | Mill-Max | 0 | Board to Board & Mezzanine Connectors Interconnect Header |
360-10-104-00-001101 | Preci-Dip | 0 | Headers & Wire Housings |
360-10-105-00-001000 | Mill-Max | 0 | Board to Board & Mezzanine Connectors Interconnect Header |
360-10-105-00-001101 | Preci-Dip | 0 | Headers & Wire Housings |
360-10-106-00-001000 | Mill-Max | 0 | Board to Board & Mezzanine Connectors Interconnect Header |
360-10-107-00-001000 | Mill-Max | 0 | Board to Board & Mezzanine Connectors Interconnect Header |
360-10-107-00-001101 | Preci-Dip | 0 | Headers & Wire Housings |
360-10-108-00-001000 | Mill-Max | 0 | Board to Board & Mezzanine Connectors Interconnect Header |
360-10-108-00-001101 | Preci-Dip | 0 | Headers & Wire Housings |